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Knowledge about Silicon Dicing Saw

From: Issued date 2019.09.02 Back

The below information is reorganized by Shenyang Heyan Technology Co., Ltd.

The silicon content in the silicon crust is 25.8%, which provides an inexhaustible source for the production of monocrystalline silicon. Since silicon is one of the most abundant elements in the earth's crust, the advantage of reserves is one of the reasons why silicon is the main material of photovoltaics for products that are destined to enter the mass market.

At present, more than 40 million transistors have been integrated on silicon wafers with the size like a grain of rice. What a fine project! This is the crystallization of multidisciplinary collaborative efforts and another milestone in the advancement of science and technology. Crystalline silicon materials (including polycrystalline silicon and monocrystalline silicon) are the most important photovoltaic materials, with a market share of more than 90%, and will remain the mainstream material for solar cells for a long period of time in the future. The production technology of polysilicon materials has long been in the hands of 10 factories of 7 companies in 3 countries including the United States, Japan and Germany, forming a technical blockade and market monopoly.

Microelectronics technology is quietly entering aerospace, industry, agriculture and defense, and is quietly entering every family. The huge 'magic power' of small silicon wafers is beyond our imagination.

Silicon wafer dicing saw introduction and principle

Silicon wafer dicing saw is also known as silicon laser cutting machine, laser dicing saw. It is the application of laser dicing saw in another new field of silicon substrate cutting in the electronics industry. The laser dicing is performed by irradiating a high-energy laser beam on the surface of the work piece to locally melt and vaporize the irradiated area, thereby achieving the purpose of dicing. Since the laser is focused by a dedicated optical system to become a very small spot, the energy density is high. As the machining is non-contact, there is no mechanical pressing force on the work piece itself, and the work piece is not easily deformed. It has extremely low thermal impact and high precision. It is widely used in the cutting and dicing of solar panels and thin metal sheets.

Application field

Laser dicing saw is mainly used for dicing and cutting of metal materials, silicon, germanium, gallium arsenide and other semiconductor substrate materials, and can process solar panels, silicon wafers, ceramic sheets, aluminum foil sheets, etc. The work pieces are fine and beautiful. The trimming is smooth. The Nd: YAG laser with continuous pumping sound and light Q-switching is used as the working light source. The two-dimensional workbench is controlled by the computer, and various movements can be performed according to the input graphic. The output power is large, the dicing precision is high, the speed is fast, and the curve and the straight line graphic cutting can be performed.

Model classification, characteristics and application of fiber laser dicing saw

Applications and markets: dicing (cutting, slicing) of monocrystalline silicon, polycrystalline silicon, amorphous silicon solar cells and silicon wafers in the solar industry.

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