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Fully Automatic Grinder-HG5260
HG5260 is a fully automatic grinding machine with a two axis three grinding table, automatic wafer transmission, loading and unloading. It is equipped with a high rigidity air floating spindle, a four axis cleaning room dedicated manipulator, a large range high-resolution thickness gauge, etc. The machine is compatible with the back grinding of two mainstream 8/12 inch wafers, achieving automatic size switching function without hardware replacement.
Product Parameters
1. Design and manufacture a large-sized integrated movement base, ensuring high stability in machine operation.
2.15 inch high sensitivity touch screen, user-friendly Chinese operating system.
3.4.8KW high-power high rigidity static pressure direct drive spindle, with a spindle speed of 1000-4000rpm.
4. Configure a high-precision thickness gauge with a measurement range of 0-4mm, a minimum resolution of 0.1um, and a repeated positioning accuracy of ± 0.5um.
5. The thinnest wafer can be ground to around 100um, and after grinding, the back TTV is ≤ 3um, and the roughness Ra is ≤ 0.02um (# 2000 grinding wheel).
6. Fully automatic clean room dedicated four axis wafer handling manipulator.
7. Strong two fluid wafer back cleaning technology.
8. Industrial computer bus control mode, faster response speed, and stronger scalability.
9. Portable HMI operating handle, convenient for machine operation and maintenance.
The overlapping design of Z1 axis grinding line and Z2 axis grinding line improves the quality and stability of the back grain of ultra-thin wafer grinding.
11. Automatic adjustment function for the final surface shape (TTV) of the wafer.
Company advantage
Mass production
We have one production center in Nanjing and one production center in Anshan with 20,000㎡plant and 170 units of production equipments. The main annual capacity of sensors is about 2,000,000 pieces.
Imported equipments
We imported 20 sets of pressure controller and 150 units of testing ovens to our production line.
Informatization management
We have the information management system of CRM, PLM, ERP, MES and DINGDING etc.
Comprehensive testing
We have our own lab and testing equipment such as lightning stroke, surging, static electricity, vibration, high-low temperature impact test and helium mass-spectrum leak detection.