Research on new technology of grinding wheel dicing machine
From: Issued date 2016.06.30 Back
With the rapid development of technology, the quality requirements of electronic components are getting higher and higher. In order to improve the quality of products, strict control is required from all aspects of design, production, inspection and transportation. In the production of surface acoustic wave devices, the high quality and high efficiency of each process are the prerequisites for efficient operation of the entire production line. As the first step in the production process of surface acoustic wave devices, the quality and efficiency of the grinding wheel dicing process directly affects the quality of the final product and the yield and productivity of the entire production line and its importance is becoming more and more obvious.
The main problem when cutting the wheel dicing machine is as below.
The materials used in the semiconductor industry are hard and brittle materials different from ordinary grinding. After many tests, we have obtained (1) when the spindle speed and cutting depth are fixed, the cutting feed speed is reduced and the cutting path width is reduced. (2) When the cutting feed speed and cutting depth are fixed, the spindle speed increases and the cutting lane width decreases. (3) The width of the scribe line using the cistern mode is smaller than the width of the scribe line of the reverse cut mode. Lower cutting forces and smaller cutting widths are achieved with a smooth, slow cutting feed rate, a smaller cutting depth and a higher spindle speed. (4) Due to the influence of the thickness of the blade, the passivation or feed rate of the blade is not suitable, and the axial vibration of the cutting machine causes the width of the cutting path to become large. (5) The operation mode of the cutting process, the type of blade, the cutting condition, the vibration size, the workpiece material, and the cutting parameters are all unsuitable, which may be factors that cause excessive cracking of the substrate.
The principle of cutting hard and brittle materials
The principle of hard and brittle material cutting is significantly different from that of metal materials. The hard and brittle materials have high hardness and brittleness. Their physical and mechanical properties, especially toughness and strength are quite different from those of metal materials. Fracture toughness and fracture strength represent material properties. The material removal principle can be generally divided into brittle fracture and plastic deformation. In general, the removal of brittle fracture is accomplished by the formation or expansion of voids and cracks, spalling and chipping. The plastic deformation removal method is similar to the chip formation process in metal grinding, and the material including scratching and chip formation is removed by shearing chip formation. As shown in Figure 3-1, when the brittle fracture type occurs, the crack occurs near the contact boundary behind the abrasive grain and grows laterally to form a split. As shown in Figure 3-2, the plastic zone is plastically deformed. It is produced in front of and below the abrasive grains, and is expanded to form a shearing zone, which generates chips and removes the material to obtain a better surface state.